Low Temperature SMD Removal

The new patented CHIP QUIK SMD #1 removal kit is fast easy to use and inexpensive. Removes QFP’s PLCC’s SOIC’s and chip components under 300?F.

Eliminates burning of board and chips lifting of pads and reflowing adjacent components. Now all PC boards with SMD’s can be safely reworked without damage. CHIP QUIK removal material can be applied with a soldering iron or warm air bath.

SMD 1 Contents

2.5 ft. CHIP QUIK material. Removes 810 SMD’S.
1 cc syringe of CHIP QUIK no clean rework paste flux.
Alcohol pads for clean up.
Complete instructions for SMD removal and cleanup.